ESSENCE-6GM
- Funding:
German Federal Ministry of Education and Research (BMBF)
- Project partner:
Nokia Solutions and Networks GmbH & Co. KG
IHP GmbH
InCirT GmbH
Infineon Technologies AG
LPKF Laser & Electronics SE
tecVenture GmbH
United Monolithic Semiconductors GmbH
Friedrich-Alexander-Universität Erlangen-Nürnberg
Fraunhofer Institut für Angewandte Festkörperphysik (IAF)
Fraunhofer Institut für Nachrichtentechnik, Heinrich-Hertz-Institut (HHI)
RWTH Aachen University
Universität Stuttgart
- Start:
October 2022
- End:
April 2026
- Contact:
Industrialisierbare Schlüsseltechnologien für Energie-effiziente Tbit-Transceiver in 6G Mobilfunksystemen (ESSENCE-6GM)
This project aims to realize scaleable D-band mm-Wave multi-antenna systems for wireless transmission up to 1 Tbit/s.
Goals include:
1. Prepare the commercial realisation of economic and highly efficient D-band transceiver systems for mobile communication with extreme high total throughput of up to 1Tbit/s over a range of several 10m’s up to 100m.
2. Pursue solutions for system architecture, system partitioning, as well as module- and component-technologies, that shall support industrial-scale production-processes and –realisation
3. Research key technologies (microelectronics, mobile communication system architecture, assembly, system integration) and components which enable scalable systems featuring high energy efficiency
At the IHE broadband antenna and packaging concepts will be developed and demonstrated to realize the goal of wireless transmission up to 1 Tbit/s.
Publications
Conference Proceedings
- A. Bhutani, M. Kaynak, M. Wietstruck, E. Bekker, I. K. Aksoyak, J. Hebeler and T. Zwick, "Sub-THz Substrate Integrated Waveguide Signal Transitions in Backend-of-Line of a Silicon Process," 2024 18th European Conference on Antennas and Propagation (EuCAP), Glasgow, United Kingdom, 2024, pp. 1-5, doi: 10.23919/EuCAP60739.2024.10501393. [Available Online]
- A. Bhutani, L. Valenziano, P. Krüger, T. Voß, T. Zwick, C. Carta and M. Wietstruck, "Sub-THz Beam-Steering Antenna in Silicon Interposer Technology", accepted for publication in European Microwave Week 2024, scheduled to be held in Sept. 2024 in Paris, France.