Advanced Bond-Wire Interconnect Solution for Ultra-Broadband Applications Covering DC to 210 GHz
Valenziano, L.; Hebeler, J.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1. doi:10.1109/TCPMT.2024.3465608

System architecture for a compact high range resolution frequency comb OFDM radar
Quint, A.; Nuß, B.; Diewald, A.; Zwick, T.
2023. International Journal of Microwave and Wireless Technologies, 15 (6), 975 – 982. doi:10.1017/S1759078722001441

3D Printing of Interdigitated Finger Capacitors Using Ultra-Precise Deposition Technology
Valenziano, L.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. 25th International Conference on Microwaves, Radar and Wireless Communications (MIKON), Wroclaw, 1st-4th July 2024, 26–30, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/MIKON60251.2024.10633928

Modified Bisection Thru-Only Deembedding Algorithm for Long Test Fixtures
Quint, A.; Valenziano, L.; Hebeler, J.; Zwick, T.; Bhutani, A.
2024. 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS), 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICMTS59902.2024.10520703

Integrated Non-sliced OAWM Engine Enabling 320 GHz Photonic-Electronic Analog-to-Digital Conversion
Drayss, D.; Fang, D.; Quint, A.; Valenziano, L.; Lauermann, M.; Lihachev, G.; Chen, Y.; Peng, H.; Randel, S.; Zwick, T.; Freude, W.; Kippenberg, T. J.; Koos, C.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, IEEEXplore

Spectrally Sliced Optical Arbitrary Waveform Measurement (OAWM) Using a Photonic Multi-Chip Receiver Assembly
Fang, D.; Drayss, D.; Chen, Y.; Lauermann, M.; Peng, H.; Lihachev, G.; Quint, A.; Valenziano, L.; Randel, S.; Zwick, T.; Freude, W.; Kippenberg, T. J.; Koos, C.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, Institute of Electrical and Electronics Engineers (IEEE)

3D Freeform Millimeter-Wave and THz Structures Based on Multi-Photon Lithography
Maier, P.; Kotz, A.; Hebeler, J.; Zhang, Q.; Benz, C.; Quint, A.; Kretschmann, M.; Harter, T.; Randel, S.; Lemmer, U.; Freude, W.; Zwick, T.; Koos, C.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, Institute of Electrical and Electronics Engineers (IEEE)

D-Band 90° Waveguide Twists using 3D Printing and PVD Metallization
Quint, A.; Kowalewski, J.; Merli, F.; Zwick, T.
2023. Proceedings of the 53rd European Microwave Conference (EuMC), Berlin, 19th-21st September 2023., 239 – 242, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC58039.2023.10290390

Broadband, Via-less Grounded Coplanar Waveguide-to-Microstrip Transition in D-band
Bekker, E.; Gramlich, G.; Quint, A.; Valenziano, L.; Oliveira, L. G. de; Bhutani, A.; Zwick, T.
2023. 2023 53rd European Microwave Conference (EuMC), Berlin, 19th-21st September 2023, 114 – 117, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC58039.2023.10290358

Frequency Comb Generation for High Range Resolution OFDM Radar
Quint, A.; Nuss, B.; Diewald, A.; Zwick, T.
2022. European Microwave Week 2021 "United in Microwaves": Conference Proceedings ; 2–7 April 2022, London, UK, 317–320, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuRAD50154.2022.9784574

Freeform terahertz structures fabricated by multi-photon lithography and metal coating
Maier, P.; Kotz, A.; Hebeler, J.; Zhang, Q.; Benz, C.; Quint, A.; Kretschmann, M.; Harter, T.; Randel, S.; Lemmer, U.; Freude, W.; Zwick, T.; Koos, C.
2023. arxiv. doi:10.48550/arXiv.2401.03316

Integrated Non-sliced OAWM Engine Enabling 320 GHz Photonic-Electronic Analog-to-Digital Conversion
Drayss, D.; Fang, D.; Quint, A.; Valenziano, L.; Lauermann, M.; Lihachev, G.; Chen, Y.; Peng, H.; Randel, S.; Zwick, T.; Freude, W.; Kippenberg, T. J.; Koos, C.
2024, März 27. Optical Fiber Communications Conference and Exhibition (OFC 2024), San Diego, CA, USA, 24.–28. März 2024