Advanced Bond-Wire Interconnect Solution for Ultra-Broadband Applications Covering DC to 210 GHz
Valenziano, L.; Hebeler, J.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. IEEE Transactions on Components, Packaging and Manufacturing Technology, 14 (11), 1921–1930. doi:10.1109/TCPMT.2024.3465608

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar
Bekker, E.; Gramlich, G.; Valenziano, L.; de Oliveira, L. G.; Antes, T.; Zwick, T.; Bhutani, A.
2024. International Journal of Microwave and Wireless Technologies, 1–12. doi:10.1017/S1759078724000266

Ultraprecise Printing of -Band Transmission Lines
Roemhild, M.; Gramlich, G.; Baur, H.; Zwick, T.; Fruehauf, N.
2023. IEEE Microwave and Wireless Technology Letters, 33 (10), 1419–1422. doi:10.1109/LMWT.2023.3300569

Process considerations for Aerosol-Jet printing of ultra fine features
Gramlich, G.; Huber, R.; Häslich, F.; Bhutani, A.; Lemmer, U.; Zwick, T.
2023. Flexible and Printed Electronics, 8 (3), Article no: 035002. doi:10.1088/2058-8585/ace3d8

Origami-inspired perovskite X-ray detector by printing and folding
Mescher, H.; Schackmar, F.; Huber, R.; Eggers, H.; Zuber, M.; Hamann, E.; Gramlich, G.; Dangelmaier, J.; Zhang, Q.; Rösch, A. G.; Zwick, T.; Hernandez-Sosa, G.; Paetzold, U. W.; Lemmer, U.
2023. npj Flexible Electronics, 7 (1), Article no: 9. doi:10.1038/s41528-023-00240-9

3D Printing of Interdigitated Finger Capacitors Using Ultra-Precise Deposition Technology
Valenziano, L.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. 25th International Conference on Microwaves, Radar and Wireless Communications (MIKON), Wroclaw, 1st-4th July 2024, 26–30, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/MIKON60251.2024.10633928

Ultra-Precise Deposition – XTPL Technology for 3D Printed Broadband Spiral Inductors
Valenziano, L.; Zeh, F.; Gramlich, G.; Zwick, T.; Bhutani, A.
2024. 2024 15th German Microwave Conference (GeMiC), Duisburg, 11th-13th March 2024, 53–56, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/GeMiC59120.2024.10485325

Ultra-Precise Deposition (UPD) Printing for Millimeter Wave Interconnects in D-Band
Gramlich, G.; Römhild, M.; Baur, H.; Bhutani, A.; Lemmer, U.; Fruehauf, N.; Zwick, T.
2024. 2023 Asia-Pacific Microwave Conference (APMC), Taipei, 5th-8th December 2023, 1 – 3, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/APMC57107.2023.10439807

Wideband, High Gain Dielectric Resonator Antenna in Embedded Surface Mount Short Horn in D-band
Bekker, E.; Gramlich, G.; Oliveira, L. G. de; Bhutani, A.; Zwick, T.
2023. 2023 53rd European Microwave Conference (EuMC), Berlin, 19th-21st September 2023, 86 – 89, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC58039.2023.10290308

Broadband, Via-less Grounded Coplanar Waveguide-to-Microstrip Transition in D-band
Bekker, E.; Gramlich, G.; Quint, A.; Valenziano, L.; Oliveira, L. G. de; Bhutani, A.; Zwick, T.
2023. 2023 53rd European Microwave Conference (EuMC), Berlin, 19th-21st September 2023, 114 – 117, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC58039.2023.10290358

Aerosol Jet Printed Millimeter Wave Interconnects in D-Band
Gramlich, G.; Huber, R.; Lemmer, U.; Zwick, T.
2022. 2022 52nd European Microwave Conference (EuMC), 298–301, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC54642.2022.9924311

Fully printed high-density temperature sensor array (Conference Presentation)
Huber, R.; Mescher, H.; Gramlich, G.; Zhang, Q.; Hernandez-Sosa, G.; Lemmer, U.
2022. R. Shinar, I. Kymissis & E. J. List-Kratochvil (Hrsg.), Organic and Hybrid Sensors and Bioelectronics XV, 18, SPIE. doi:10.1117/12.2633363

Aerosol Jet Printed Microstrip Lines on Polyimide for D-Band
Gramlich, G.; Hebeler, J.; Bohn, C.; Lemmer, U.; Zwick, T.
2022. 2021 51st European Microwave Conference (EuMC): 4–6 April 2022, London, UK, 551–554, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC50147.2022.9784303

Dual-Band Probes with Broadband Diplexers for 2-Port Measurement up to 170 GHz
Boes, F.; Gramlich, G.
2018, November 15. COMPASS (2018), München, Deutschland, 15. November 2018