Packaging Lab
The equipment available in our laboratory for integrated circuit packaging, assembly and interconnection.
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Fully-automatic wirebonder, FS-Bondtech FS-5610i
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Semi-automatic wirebonder, TPT HB16
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FlipChip Bonder Fineplacer Pico
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FlipChip Bonder Fineplacer Lambda
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Leica DM6 Microscope
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