Publikationen

Advanced Bond-Wire Interconnect Solution for Ultra-Broadband Applications Covering DC to 210 GHz
Valenziano, L.; Hebeler, J.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1. doi:10.1109/TCPMT.2024.3465608

3D Printing of Interdigitated Finger Capacitors Using Ultra-Precise Deposition Technology
Valenziano, L.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. 25th International Conference on Microwaves, Radar and Wireless Communications (MIKON), Wroclaw, 1st-4th July 2024, 26–30, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/MIKON60251.2024.10633928

Ultra-Precise Deposition – XTPL Technology for 3D Printed Broadband Spiral Inductors
Valenziano, L.; Zeh, F.; Gramlich, G.; Zwick, T.; Bhutani, A.
2024. 2024 15th German Microwave Conference (GeMiC), Duisburg, 11th-13th March 2024, 53–56, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/GeMiC59120.2024.10485325

Sub-THz Conformal Lens Integrated WR3.4 Antenna for High-Gain Beam-Steering
Bhutani, A.; Dittmer, J.; Valenziano, L.; Zwick, T.
2024. IEEE Open Journal of Antennas and Propagation, 5 (5), 1306–1319. doi:10.1109/OJAP.2024.3412282

Integrated Non-sliced OAWM Engine Enabling 320 GHz Photonic-Electronic Analog-to-Digital Conversion
Drayss, D.; Fang, D.; Quint, A.; Valenziano, L.; Lauermann, M.; Lihachev, G.; Chen, Y.; Peng, H.; Randel, S.; Zwick, T.; et al.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, IEEEXplore

Spectrally Sliced Optical Arbitrary Waveform Measurement (OAWM) Using a Photonic Multi-Chip Receiver Assembly
Fang, D.; Drayss, D.; Chen, Y.; Lauermann, M.; Peng, H.; Lihachev, G.; Quint, A.; Valenziano, L.; Randel, S.; Zwick, T.; et al.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, Institute of Electrical and Electronics Engineers (IEEE)

Linear-Drive Amplifier-Less 112 Gbit/s PAM4 Operation of a Silicon-Organic Hybrid (SOH) Mach-Zehnder Modulator at 265 mV
Schwarzenberger, A.; Singer, S.; Eschenbaum, C.; Martens, M.; Mertens, A.; Dagher, G.; Valenziano, L.; Sarwar, S.; Kholeif, H.; Kotz, A.; et al.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, Institute of Electrical and Electronics Engineers (IEEE)

Modified Bisection Thru-Only Deembedding Algorithm for Long Test Fixtures
Quint, A.; Valenziano, L.; Hebeler, J.; Zwick, T.; Bhutani, A.
2024. 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS), 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICMTS59902.2024.10520703

Spectrally Sliced Optical Arbitrary Waveform Measurement (OAWM) Using a Photonic Multi-Chip Receiver Assembly
Fang, D.; Drayss, D.; Chen, Y.; Lauermann, M.; Peng, H.; Lihachev, G.; Quinte, A.; Valenziano, L.; Randel, S.; Zwick, T.; et al.
2024, March 26. Optical Fiber Communications Conference and Exhibition (OFC 2024), San Diego, CA, USA, March 24–28, 2024

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar
Bekker, E.; Gramlich, G.; Valenziano, L.; de Oliveira, L. G.; Antes, T.; Zwick, T.; Bhutani, A.
2024. International Journal of Microwave and Wireless Technologies, 1–12. doi:10.1017/S1759078724000266

Integrated Non-sliced OAWM Engine Enabling 320 GHz Photonic-Electronic Analog-to-Digital Conversion
Drayss, D.; Fang, D.; Quint, A.; Valenziano, L.; Lauermann, M.; Lihachev, G.; Chen, Y.; Peng, H.; Randel, S.; Zwick, T.; et al.
2024, March 27. Optical Fiber Communications Conference and Exhibition (OFC 2024), San Diego, CA, USA, March 24–28, 2024

A comprehensive packaging solution from DC to 113 GHz for InGaAs amplifiers
Valenziano, L.; Hebeler, J.; Sherifaj, A.; Thome, F.; Koos, C.; Zwick, T.; Bhutani, A.
2024. Electronics Letters, 60 (6), Art.-Nr.: e13143. doi:10.1049/ell2.13143

Broadband, Via-less Grounded Coplanar Waveguide-to-Microstrip Transition in D-band
Bekker, E.; Gramlich, G.; Quint, A.; Valenziano, L.; Oliveira, L. G. de; Bhutani, A.; Zwick, T.
2023. 2023 53rd European Microwave Conference (EuMC), Berlin, 19th-21st September 2023, 114 – 117, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC58039.2023.10290358